IMPORTANT DATES:

Abstract Submission Deadline:

27 Mar 2009

Notification of Acceptance:

03 Apr 2009

Early Bird Registration:

17 Apr 2009

Accommodation Reservation:

20 Apr 2009

Short Courses:

21 June, 2009

ACE-X 2009:

22-23 June, 2009

 

 

ACE-X 2009 ANNOUNCEMENT(PDF)
download here

ADHESIVE BONDING
ADHESIVE BONDING CALL FOR PAPERS & ANNOUNCEMENT (PDF) download here

Organized by:
Prof. Lucas FM  da  SILVA
University of Porto,
Portugal
Prof. Luca GOGLIO
Politecnico di Torino,
Italy  




Editors: Lucas FM da Silva & Andreas Öchsner
Modeling of Adhesively Bonded Joints

Publisher: Springer (2008)
IISBN: 978‐3‐540‐79055‐6
   
   
Publications:
Selected papers will be published in the:

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY:
http://www.brill.nl/jast

THE JOURNAL OF ADHESION
http://www.tandf.co.uk/journals/titles/00218464.asp

INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
http://www.elsevier.com


Publishing Track Record:
ACE-X 2008 / Special Session Adhesive Bonding:

    1. International Journal of Adhesion and Adhesives
    2. Journal of Adhesion Science and Technology
    3. The Journal of Adhesion

ACE-X 2007/ Special Session Adhesive Bonding:

    1. International Journal of Adhesion and Adhesives
    2. Journal of Adhesion Science and Technology
 

Topics:
 The following aspects of adhesive bonding will be covered among others:

  •  Fundamental aspects of adhesion;
  •  The science and technology of surfaces;
  •  Advances in adhesive materials;
  •  Mechanical properties of bonded joints;
  •  Innovative designs and applications;
  •  Testing and standardization;
  •  Industrial aspects;
  •  Quality procedures;
  •  Environmental and ecological aspects;
  •  Bio-adhesion.
 
Invited speakers:

‘Investigation of the thermo-viscoelastic material behaviour of adhesive bonds close to the glass transition temperature’
Dr. -Ing. Michael Johlitz
Saarland University, Germany

‘Determination of the cohesive law in adhesive bonded joints under pure mode I loading’
Prof. Marcelo de Moura
University of Porto, Portugal

‘Influence of hydrostatic pressure on the behaviour of an adhesive in an assembly’
Prof. Jean-Yves Cognard
ENSIETA, France

‘Modeling Flow and Yield Behaviors of Conductive Epoxy Adhesives During Processing and Cure’
Prof. Erol Sancaktar
The University of Akron, USA

‘Tearing/Debonding as a test for characterization of cohesive laws in adhesives’
Prof. Juan Carlos Suárez Bermejo
Universidad Politécnica de Madrid, Spain

‘Impact fatigue of bonded joints’
Dr Ian Ashcroft
Loughborough University,
UK

‘The fatigue behaviour of ACDC anodised 2xxx series aluminium’
Prof Gary Critchlow
Loughborough University,
UK

‘Stress analyses of the strength predictions of bonded shrink fitted joints under push-off and torsional loadings’
Prof. Toshiyuki Sawa
Hiroshima University,
Japan

‘Optimum sizing of ASTM D5656 specimen configuration’
Professor Liyong Tong
University of Sydney,
Australia

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